Apple Inc.
Film-based image sensor with planarized contacts

Abstract:

An imaging apparatus includes a semiconductor substrate, an array of pixel circuits formed on the semiconductor substrate and including respective pixel electrodes. A layer of a photosensitive medium overlies the pixel electrodes and has a lower surface in electrical contact with the pixel electrodes, and is configured to convert incident photons into charge carriers, which are collected by the pixel electrodes. A planar conductive top electrode, which is at least partially transparent, overlies an upper surface of the photosensitive medium. A bias circuit is formed on the semiconductor substrate and configured to provide a bias potential for application to the photosensitive medium. A bias contact extends from the bias circuit to the top electrode so as to apply the bias potential to the top electrode while contacting the top electrode along a plane that is parallel to the upper surface of the photosensitive medium.