Apple Inc.
Headphone earcup structure
Last updated:
Abstract:
A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.
Status:
Grant
Type:
Utility
Filling date:
16 Sep 2020
Issue date:
15 Mar 2022