Apple Inc.
HEADPHONE EARCUP STRUCTURE

Last updated:

Abstract:

A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.

Status:
Application
Type:

Utility

Filling date:

16 Sep 2020

Issue date:

17 Mar 2022