Apple Inc.
MEMS sensor with dual pendulous proof masses

Last updated:

Abstract:

A MEMS sensor is disclosed that includes dual pendulous proof masses comprised of sections of different thickness to allow simultaneous suppression of vertical and lateral thermal gradient-induced offsets in a MEMS sensor while still allowing for the normal operation of the accelerometer. In an embodiment, the structure and different sections of the MEMS sensor is realized using multiple polysilicon layers. In other embodiments, the structure and different thickness sections may be realized with other materials and processes. For example, plating, etching, or silicon-on-nothing (SON) processing.

Status:
Grant
Type:

Utility

Filling date:

29 Sep 2017

Issue date:

1 Sep 2020