Apple Inc.
Systems and methods for implementing a scalable system
Last updated:
Abstract:
Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
Status:
Grant
Type:
Utility
Filling date:
4 Feb 2019
Issue date:
11 Aug 2020