Apple Inc.
Systems and methods for implementing a scalable system

Last updated:

Abstract:

Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Status:
Grant
Type:

Utility

Filling date:

4 Feb 2019

Issue date:

11 Aug 2020