Apple Inc.
Coated substrate and process for cutting a coated substrate

Last updated:

Abstract:

A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.

Status:
Grant
Type:

Utility

Filling date:

18 Dec 2014

Issue date:

21 Jan 2020