Apple Inc.
Camera module design with lead frame and plastic moulding
Last updated:
Abstract:
A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmolding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.
Status:
Grant
Type:
Utility
Filling date:
6 Aug 2015
Issue date:
15 Oct 2019