Apple Inc.
Selective Soldering with Photonic Soldering Technology

Last updated:

Abstract:

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Status:
Application
Type:

Utility

Filling date:

28 Jan 2021

Issue date:

17 Jun 2021