Apple Inc.
Selective Soldering with Photonic Soldering Technology

Last updated:

Abstract:

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Status:
Application
Type:

Utility

Filling date:

30 Mar 2020

Issue date:

11 Feb 2021