Apple Inc.
Selective Soldering with Photonic Soldering Technology
Last updated:
Abstract:
Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.
Status:
Application
Type:
Utility
Filling date:
30 Mar 2020
Issue date:
11 Feb 2021