Apple Inc.
OPTIMIZED WELD STRENGTH FOR DISSIMILAR MATERIALS

Abstract:

An electronic device can include a component including a first material joined to a component including a second, different material. The first material can include steel and copper, while the second material can include aluminum. The first material can be joined to the second material by a pulsed laser welding process that forms an interface region having a ratio of an interface region length to a lateral length greater than about 1.4.