Apple Inc.
Integrated laser module

Abstract:

An optoelectronic device includes a driver die including drive circuits and first bond pads on a front surface of the driver die. An emitter die is mounted on the front surface of the driver die and includes one or more vertical emitters and second bond pads connected to the vertical emitters. An encapsulation layer contains the emitter die and has an inner surface adjacent to the front surface of the driver die. Conductive vias extend through the encapsulation layer and have inner ends connected to the first bond pads and outer ends at an outer surface of the encapsulation layer. A redistribution layer is disposed over the outer surface of the encapsulation layer and includes conductive traces, each of which is connected to at least one terminal selected from a group of terminals consisting of the second bond pads and the outer ends of the conductive vias.