Apple Inc.
TUNGSTEN FRAME OF A HAPTIC FEEDBACK MODULE FOR A PORTABLE ELECTRONIC DEVICE

Last updated:

Abstract:

According to some embodiments, a haptic feedback module for generating a haptic feedback event is described. The haptic feedback module includes an enclosure having walls that define a cavity. The enclosure is capable of carrying operational components within the cavity that include a frame that includes tungsten, a magnetic coil element that is capable of generating a magnetic field, a magnetic element that is carried within an aperture of the frame, linear-actuation end stops that are welded to a first end of the frame and a second end of the frame that opposes the first end, and springs that couple together the walls of the enclosure to the linear-actuation end stops.

Status:
Application
Type:

Utility

Filling date:

17 Jan 2019

Issue date:

12 Mar 2020