Apple Inc.
Exposed wire-bonding for sensing liquid and water in electronic devices

Last updated:

Abstract:

An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor affixed to a die disposed in the sensor volume, and an exposed moisture detection conductor positioned in the sensor volume.

Status:
Grant
Type:

Utility

Filling date:

21 Apr 2020

Issue date:

23 Aug 2022