Axcelis Technologies, Inc.
REDUCTION OF CONDENSED GASES ON CHAMBER WALLS VIA PURGE GAS DILUTION AND EVACUATION FOR SEMICONDUCTOR PROCESSING EQUIPMENT

Abstract:

A system, method, and apparatus for heating a workpiece in chamber provides one or more surfaces generally enclosing a chamber volume. Vacuum and purge gas ports are in in fluid communication with the chamber volume. A heater apparatus selectively heats the workpiece on a workpiece support to a predetermined temperature and generates an outgassed material within the chamber volume. A vacuum valve provides selective fluid communication between a vacuum source and the vacuum port. A purge gas valve provides selective fluid communication between a purge gas source for a purge gas and the purge gas port. A controller controls the vacuum and purge gas valves to selectively flow the purge gas from the purge gas port to the vacuum port at a predetermined pressure while the workpiece is heated, thus removing and preventing condensation of the outgassed material on the chamber surfaces.