Advanced Energy Industries, Inc.
SPATIAL MONITORING AND CONTROL OF PLASMA PROCESSING ENVIRONMENTS

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Abstract:

Systems and methods for plasma processing are disclosed. An exemplary system may include a plasma processing chamber including a source to produce a plasma in the processing chamber and at least two bias electrodes arranged within the plasma processing chamber to control plasma sheaths proximate to the bias electrodes. A chuck is disposed to support a substrate, and a source generator is coupled to the plasma electrode. At least one bias supply is coupled to the at least two bias electrodes, and a controller is included to control the at least one bias supply to control the plasma sheaths proximate to the bias electrodes.

Status:
Application
Type:

Utility

Filling date:

9 Jun 2020

Issue date:

7 Jan 2021