Amkor Technology, Inc.
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

Abstract:

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 .mu.m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.