Amkor Technology
Patents, Design & Utilities
Last updated:
List of all Amkor Technology patents 157 in total
| Status | Patent |
|---|---|
Grant | Utility: Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate Filling date: 6 Sep 2025 Issue date: 30 Aug 2022 |
Grant | Utility: Semiconductor device and method of manufacturing semiconductor device Filling date: 6 Sep 2025 Issue date: 7 Jun 2022 |
Grant | Utility: Semiconductor device and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 21 Dec 2021 |
Grant | Utility: Semiconductor package and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 19 Oct 2021 |
Grant | Utility: Semiconductor devices and methods of manufacturing semiconductor devices Filling date: 6 Sep 2025 Issue date: 1 Jun 2021 |
Grant | Utility: Land structure for semiconductor package and method therefor Filling date: 6 Sep 2025 Issue date: 25 May 2021 |
Grant | Utility: Electronic package structure with improved board level reliability Filling date: 6 Sep 2025 Issue date: 18 May 2021 |
Application | Utility: SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE Filling date: 6 Sep 2025 Issue date: 18 Mar 2021 |
Grant | Utility: Semiconductor package and fabricating method thereof Filling date: 6 Sep 2025 Issue date: 9 Mar 2021 |
Grant | Utility: Semiconductor device having conductive wire with increased attachment angle and method Filling date: 6 Sep 2025 Issue date: 9 Mar 2021 |
Grant | Utility: Packaged electronic device having integrated antenna and locking structure Filling date: 6 Sep 2025 Issue date: 16 Feb 2021 |
Application | Utility: SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES Filling date: 6 Sep 2025 Issue date: 11 Feb 2021 |
Grant | Utility: Method of forming a molded substrate electronic package and structure Filling date: 6 Sep 2025 Issue date: 2 Feb 2021 |
Grant | Utility: Semiconductor package using a coreless signal distribution structure Filling date: 6 Sep 2025 Issue date: 26 Jan 2021 |
Grant | Utility: Wafer level fan out semiconductor device and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 26 Jan 2021 |
Application | Utility: WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME Filling date: 6 Sep 2025 Issue date: 21 Jan 2021 |
Application | Utility: SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 21 Jan 2021 |
Application | Utility: ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 21 Jan 2021 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 21 Jan 2021 |
Grant | Utility: Method of manufacturing a semiconductor device Filling date: 6 Sep 2025 Issue date: 19 Jan 2021 |
Grant | Utility: Integrated shield package and method Filling date: 6 Sep 2025 Issue date: 5 Jan 2021 |
Application | Utility: SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH Filling date: 6 Sep 2025 Issue date: 31 Dec 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Filling date: 6 Sep 2025 Issue date: 24 Dec 2020 |
Application | Utility: Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby Filling date: 6 Sep 2025 Issue date: 24 Dec 2020 |
Grant | Utility: Method of manufacturing a package-on-package type semiconductor package Filling date: 6 Sep 2025 Issue date: 15 Dec 2020 |
Grant | Utility: Method of manufacturing a semiconductor device Filling date: 6 Sep 2025 Issue date: 15 Dec 2020 |
Grant | Utility: Embedded vibration management system having an array of vibration absorbing structures Filling date: 6 Sep 2025 Issue date: 8 Dec 2020 |
Grant | Utility: Semiconductor package with multiple compartments Filling date: 6 Sep 2025 Issue date: 24 Nov 2020 |
Grant | Utility: Method of forming an electronic device structure having an electronic component with an on-edge orientation and related structures Filling date: 6 Sep 2025 Issue date: 24 Nov 2020 |
Application | Utility: SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS Filling date: 6 Sep 2025 Issue date: 19 Nov 2020 |
Application | Utility: PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE Filling date: 6 Sep 2025 Issue date: 19 Nov 2020 |
Application | Utility: Method and System for Packing Optimization of Semiconductor Devices Filling date: 6 Sep 2025 Issue date: 12 Nov 2020 |
Grant | Utility: Electronic device with top side pin array and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 10 Nov 2020 |
Grant | Utility: Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure Filling date: 6 Sep 2025 Issue date: 10 Nov 2020 |
Application | Utility: SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 5 Nov 2020 |
Grant | Utility: Method of forming a packaged semiconductor device having enhanced wettable flank and structure Filling date: 6 Sep 2025 Issue date: 3 Nov 2020 |
Grant | Utility: Semiconductor package using a polymer substrate Filling date: 6 Sep 2025 Issue date: 3 Nov 2020 |
Application | Utility: SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 29 Oct 2020 |
Grant | Utility: Thin bonded interposer package Filling date: 6 Sep 2025 Issue date: 27 Oct 2020 |
Grant | Utility: Embedded ball land substrate, semiconductor package, and manufacturing methods Filling date: 6 Sep 2025 Issue date: 27 Oct 2020 |
Application | Utility: SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES Filling date: 6 Sep 2025 Issue date: 22 Oct 2020 |
Application | Utility: STACKABLE VIA PACKAGE AND METHOD Filling date: 6 Sep 2025 Issue date: 22 Oct 2020 |
Application | Utility: METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES AND PACKAGES FORMED THEREBY Filling date: 6 Sep 2025 Issue date: 22 Oct 2020 |
Grant | Utility: Encapsulated semiconductor package Filling date: 6 Sep 2025 Issue date: 20 Oct 2020 |
Grant | Utility: Semiconductor device with through-mold via Filling date: 6 Sep 2025 Issue date: 20 Oct 2020 |
Application | Utility: SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 15 Oct 2020 |
Application | Utility: STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE Filling date: 6 Sep 2025 Issue date: 15 Oct 2020 |
Grant | Utility: Semiconductor device with thin redistribution layers Filling date: 6 Sep 2025 Issue date: 13 Oct 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 8 Oct 2020 |
Grant | Utility: Electronic device with adaptive vertical interconnect and fabricating method thereof Filling date: 6 Sep 2025 Issue date: 29 Sep 2020 |
Showing 1 to 50 of 157 patents.