Amkor Technology, Inc.
Semiconductor Package With EMI Shield and Fabricating Method Thereof
Last updated:
Abstract:
A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.
Status:
Application
Type:
Utility
Filling date:
30 Jan 2020
Issue date:
30 Jul 2020