Amkor Technology, Inc.
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Abstract:
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.
Status:
Application
Type:
Utility
Filling date:
21 May 2019
Issue date:
6 Feb 2020