Amkor Technology, Inc.
Semiconductor package and fabricating method thereof

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Abstract:

A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Status:
Grant
Type:

Utility

Filling date:

29 Jan 2019

Issue date:

9 Mar 2021