Amkor Technology, Inc.
Semiconductor package and fabricating method thereof
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Abstract:
A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
Status:
Grant
Type:
Utility
Filling date:
29 Jan 2019
Issue date:
9 Mar 2021