Amkor Technology, Inc.
Method of manufacturing a semiconductor device
Last updated:
Abstract:
A method for manufacturing a semiconductor device, for example formed utilizing component stacking. As non-limiting examples, various aspects of this disclosure provide a method for reducing warpage and/or stress in stacked semiconductor devices.
Status:
Grant
Type:
Utility
Filling date:
10 Aug 2015
Issue date:
15 Dec 2020