Amkor Technology, Inc.
Method of manufacturing a semiconductor device

Last updated:

Abstract:

A method for manufacturing a semiconductor device, for example formed utilizing component stacking. As non-limiting examples, various aspects of this disclosure provide a method for reducing warpage and/or stress in stacked semiconductor devices.

Status:
Grant
Type:

Utility

Filling date:

10 Aug 2015

Issue date:

15 Dec 2020