Amkor Technology, Inc.
Electronic device with top side pin array and manufacturing method thereof

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Abstract:

An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Status:
Grant
Type:

Utility

Filling date:

28 May 2019

Issue date:

10 Nov 2020