Amkor Technology, Inc.
Semiconductor device and manufacturing method thereof
Last updated:
Abstract:
A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.
Status:
Grant
Type:
Utility
Filling date:
13 Apr 2017
Issue date:
3 Dec 2019