Amkor Technology, Inc.
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
Last updated:
Abstract:
A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.
Status:
Grant
Type:
Utility
Filling date:
21 Dec 2016
Issue date:
8 Oct 2019