Amkor Technology, Inc.
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

Last updated:

Abstract:

A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.

Status:
Grant
Type:

Utility

Filling date:

21 Dec 2016

Issue date:

8 Oct 2019