Amkor Technology, Inc.
Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof
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Abstract:
Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
Status:
Grant
Type:
Utility
Filling date:
28 Feb 2017
Issue date:
12 Nov 2019