Amkor Technology, Inc.
Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof

Last updated:

Abstract:

Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.

Status:
Grant
Type:

Utility

Filling date:

28 Feb 2017

Issue date:

12 Nov 2019