Amkor Technology, Inc.
Manufacturing method of semiconductor device and semiconductor device thereof
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Abstract:
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.
Status:
Grant
Type:
Utility
Filling date:
21 Aug 2018
Issue date:
10 Sep 2019