FormFactor, Inc.
Method of centering probe head in mounting frame

Last updated:

Abstract:

A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.

Status:
Application
Type:

Utility

Filling date:

28 Feb 2022

Issue date:

1 Sep 2022