FormFactor, Inc.
Method of centering probe head in mounting frame
Last updated:
Abstract:
A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
Status:
Application
Type:
Utility
Filling date:
28 Feb 2022
Issue date:
1 Sep 2022