KLA Corporation
Systems and Methods of High-Resolution Review for Semiconductor Inspection in Backend and Wafer Level Packaging

Last updated:

Abstract:

A review system and operation method directs a beam of light toward a sample on a stage. The sample is a wafer level packaging wafer or a backend wafer. Defect review is performed based on the light reflected from the sample. The review system can use one or more of: a fluid supplied by an immersion subsystem that includes a fluid supply unit and a fluid removal unit; an illumination pattern for differential phase contrast; or ultraviolet or deep ultraviolet wavelengths.

Status:
Application
Type:

Utility

Filling date:

21 Mar 2020

Issue date:

23 Sep 2021