KLA Corporation
DESIGN-TO-WAFER IMAGE CORRELATION BY COMBINING INFORMATION FROM MULTIPLE COLLECTION CHANNELS

Abstract:

At least three dark field images of a feature on a semiconductor wafer can be formed using an optical inspection system. Each of the at least three dark field images is from a different channel of the optical inspection system using an aperture that is fully open during image generation. The dark field images can be fused into a pseudo wafer image that is aligned with a corresponding design. This alignment can improve care area placement.