KLA Corporation
Wafer Level Spatial Signature Grouping Using Transfer Learning

Last updated:

Abstract:

A wafer map is classified using the machine learning based model and a signature on the wafer map. The machine learning based model uses transfer learning. The machine learning based model can be trained using images from various sources that are extracted and augmented and their features extracted. These extracted features can be classified into defects that occur during semiconductor manufacturing.

Status:
Application
Type:

Utility

Filling date:

17 Aug 2021

Issue date:

3 Mar 2022