KLA Corporation
Design-assisted inspection for DRAM and 3D NAND devices

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Abstract:

With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.

Status:
Grant
Type:

Utility

Filling date:

16 Aug 2019

Issue date:

19 Apr 2022