KLA Corporation
Method and system for manufacturing integrated circuit

Abstract:

The method for manufacturing an integrated circuit includes: obtaining measurement data according to a first group of overlay marks on a first wafer, where the first group of overlay marks are disposed in a first region on the first wafer; obtaining a first parameter set according to a first model and the measurement data; and projecting the first parameter set into a second region on a second wafer to obtain simulated compensation data, where the second region includes a second group of overlay marks whose quantity is greater than that of the first group of overlay marks.