KLA Corporation
High Flow Vacuum Chuck

Abstract:

A vacuum chuck is provided, comprising: a vacuum buffer in fluid communication with a vacuum source, the vacuum buffer being an enclosed volume in the vacuum chuck; a top plate, defining surface features on a first side, and an internal network of distribution channels open to the first side via through holes; and a flow valve configured to control fluid communication between the network of distribution channels and the vacuum buffer. By opening the flow valve, negative pressure is applied from between a substrate disposed on the first side of the top plate through the through holes into the vacuum buffer, thereby flattening the substrate against at least part of the first side of the top plate.