Kulicke and Soffa Industries, Inc.
Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine

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Abstract:

A method of determining a bonding status between wire and at least one bonding location of a semiconductor device is provided. The method includes the steps of: (a) bonding a portion of wire to at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine; and (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a predetermined height range, thereby determining if the portion of wire is bonded to the at least one bonding location.

Status:
Grant
Type:

Utility

Filling date:

16 Jul 2020

Issue date:

2 Aug 2022