| Utility: WIRE BONDING MACHINES INCLUDING LINEAR MOTOR SYSTEMS Filling date: 26 Sep 2025 Issue date: 8 Sep 2022 | 24 May 2022 | 8 Sep 2022 |
| Utility: METHODS OF DETERMINING SHEAR STRENGTH OF BONDED FREE AIR BALLS ON WIRE BONDING MACHINES Filling date: 26 Sep 2025 Issue date: 25 Aug 2022 | 7 Feb 2022 | 25 Aug 2022 |
| Utility: SYSTEMS AND METHODS FOR PERFORATING FLEXIBLE FILMS, AND RELATED PUNCHING TOOLS Filling date: 26 Sep 2025 Issue date: 4 Aug 2022 | 21 Apr 2022 | 4 Aug 2022 |
| Utility: Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine Filling date: 26 Sep 2025 Issue date: 2 Aug 2022 | 16 Jul 2020 | 2 Aug 2022 |
| Utility: INTELLIGENT PATTERN RECOGNITION SYSTEMS FOR WIRE BONDING AND OTHER ELECTRONIC COMPONENT PACKAGING EQUIPMENT, AND RELATED METHODS Filling date: 26 Sep 2025 Issue date: 21 Jul 2022 | 14 Jan 2022 | 21 Jul 2022 |
| Utility: Linear motors and wire bonding machines including the same Filling date: 26 Sep 2025 Issue date: 12 Jul 2022 | 16 Apr 2020 | 12 Jul 2022 |
| Utility: METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BONDING TOOLS Filling date: 26 Sep 2025 Issue date: 23 Jun 2022 | 14 Dec 2021 | 23 Jun 2022 |
| Utility: METHODS OF DETECTING CONNECTION ISSUES BETWEEN A WIRE BONDING TOOL AND AN ULTRASONIC TRANSDUCER OF A WIRE BONDING MACHINE Filling date: 26 Sep 2025 Issue date: 16 Jun 2022 | 7 Dec 2021 | 16 Jun 2022 |
| Utility: Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods Filling date: 26 Sep 2025 Issue date: 24 May 2022 | 19 May 2021 | 24 May 2022 |
| Utility: Systems and methods for perforating flexible films, and related punching tools Filling date: 26 Sep 2025 Issue date: 24 May 2022 | 8 Apr 2021 | 24 May 2022 |
| Utility: SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING TRAJECTORIES IN THE FORMATION OF WIRE LOOPS Filling date: 26 Sep 2025 Issue date: 19 May 2022 | 3 Feb 2022 | 19 May 2022 |
| Utility: ULTRASONIC WELDING SYSTEMS AND METHODS OF USING THE SAME Filling date: 26 Sep 2025 Issue date: 12 May 2022 | 27 Jan 2022 | 12 May 2022 |
| Utility: METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF MONITORING AN ACCURACY OF BOND FORCE ON A WIRE BONDING MACHINE, AND RELATED METHODS Filling date: 26 Sep 2025 Issue date: 5 May 2022 | 3 Nov 2021 | 5 May 2022 |
| Utility: Systems and methods for bonding semiconductor elements Filling date: 26 Sep 2025 Issue date: 5 Apr 2022 | 12 May 2020 | 5 Apr 2022 |
| Utility: Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops Filling date: 26 Sep 2025 Issue date: 29 Mar 2022 | 22 Apr 2020 | 29 Mar 2022 |
| Utility: Ultrasonic welding systems and methods of using the same Filling date: 26 Sep 2025 Issue date: 29 Mar 2022 | 26 Nov 2019 | 29 Mar 2022 |
| Utility: Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops Filling date: 26 Sep 2025 Issue date: 15 Mar 2022 | 13 Jun 2019 | 15 Mar 2022 |
| Utility: OVENS FOR EQUIPMENT SUCH AS DIE ATTACH SYSTEMS, FLIP CHIP BONDING SYSTEMS, CLIP ATTACH SYSTEMS, AND RELATED METHODS Filling date: 26 Sep 2025 Issue date: 23 Dec 2021 | 16 Jun 2021 | 23 Dec 2021 |
| Utility: Methods of bonding of semiconductor elements to substrates, and related bonding systems Filling date: 26 Sep 2025 Issue date: 21 Dec 2021 | 7 Jan 2020 | 21 Dec 2021 |
| Utility: METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS Filling date: 26 Sep 2025 Issue date: 16 Dec 2021 | 26 Aug 2021 | 16 Dec 2021 |
| Utility: METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A SUPPORT STRUCTURE ON A WIRE BONDING MACHINE, AND RELATED METHODS Filling date: 26 Sep 2025 Issue date: 30 Sep 2021 | 25 Mar 2021 | 30 Sep 2021 |
| Utility: BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND RELATED METHODS Filling date: 26 Sep 2025 Issue date: 2 Sep 2021 | 19 May 2021 | 2 Sep 2021 |
| Utility: METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS Filling date: 26 Sep 2025 Issue date: 26 Aug 2021 | 11 May 2021 | 26 Aug 2021 |
| Utility: ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAME Filling date: 26 Sep 2025 Issue date: 19 Aug 2021 | 6 Apr 2021 | 19 Aug 2021 |
| Utility: SYSTEMS AND METHODS FOR PERFORATING FLEXIBLE FILMS, AND RELATED PUNCHING TOOLS Filling date: 26 Sep 2025 Issue date: 22 Jul 2021 | 8 Apr 2021 | 22 Jul 2021 |
| Utility: Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods Filling date: 26 Sep 2025 Issue date: 29 Jun 2021 | 15 Jan 2019 | 29 Jun 2021 |
| Utility: Bond head assemblies including reflective optical elements, related bonding machines, and related methods Filling date: 26 Sep 2025 Issue date: 8 Jun 2021 | 20 Oct 2017 | 8 Jun 2021 |
| Utility: Systems and methods for perforating flexible films, and related punching tools Filling date: 26 Sep 2025 Issue date: 18 May 2021 | 15 Aug 2019 | 18 May 2021 |
| Utility: Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same Filling date: 26 Sep 2025 Issue date: 18 May 2021 | 27 Jun 2019 | 18 May 2021 |
| Utility: Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods Filling date: 26 Sep 2025 Issue date: 18 May 2021 | 3 Oct 2018 | 18 May 2021 |
| Utility: Wedge bonding tools, wedge bonding systems, and related methods Filling date: 26 Sep 2025 Issue date: 27 Apr 2021 | 22 Aug 2019 | 27 Apr 2021 |
| Utility: METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS Filling date: 26 Sep 2025 Issue date: 1 Apr 2021 | 7 Jan 2020 | 1 Apr 2021 |
| Utility: METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO A SUBSTRATE, INCLUDING USE OF A REDUCING GAS, AND RELATED BONDING MACHINES Filling date: 26 Sep 2025 Issue date: 25 Feb 2021 | 5 Nov 2020 | 25 Feb 2021 |
| Utility: METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING LOCATION ON A WIRE BONDING MACHINE Filling date: 26 Sep 2025 Issue date: 10 Dec 2020 | 2 Jun 2020 | 10 Dec 2020 |
| Utility: Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machines Filling date: 26 Sep 2025 Issue date: 8 Dec 2020 | 11 Feb 2019 | 8 Dec 2020 |
| Utility: Ribbon bonding tools and methods of using the same Filling date: 26 Sep 2025 Issue date: 24 Nov 2020 | 16 Mar 2018 | 24 Nov 2020 |
| Utility: METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING LOCATION ON A WIRE BONDING MACHINE Filling date: 26 Sep 2025 Issue date: 5 Nov 2020 | 16 Jul 2020 | 5 Nov 2020 |
| Utility: LINEAR MOTORS AND WIRE BONDING MACHINES INCLUDING THE SAME Filling date: 26 Sep 2025 Issue date: 29 Oct 2020 | 16 Apr 2020 | 29 Oct 2020 |
| Utility: RIBBON BONDING TOOLS AND METHODS OF USING THE SAME Filling date: 26 Sep 2025 Issue date: 29 Oct 2020 | 16 Mar 2018 | 29 Oct 2020 |
| Utility: Systems and methods of operating wire bonding machines including clamping systems Filling date: 26 Sep 2025 Issue date: 1 Sep 2020 | 9 Jan 2019 | 1 Sep 2020 |
| Utility: SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS Filling date: 26 Sep 2025 Issue date: 27 Aug 2020 | 12 May 2020 | 27 Aug 2020 |
| Utility: Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine Filling date: 26 Sep 2025 Issue date: 25 Aug 2020 | 26 Jun 2019 | 25 Aug 2020 |
| Utility: METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHODS FOR CHECKING FOR ADEQUATE CLEARANCE BETWEEN ADJACENT WIRE LOOPS Filling date: 26 Sep 2025 Issue date: 6 Aug 2020 | 22 Apr 2020 | 6 Aug 2020 |
| Utility: Systems and methods for bonding semiconductor elements Filling date: 26 Sep 2025 Issue date: 23 Jun 2020 | 4 Dec 2017 | 23 Jun 2020 |
| Utility: Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops Filling date: 26 Sep 2025 Issue date: 2 Jun 2020 | 2 May 2019 | 2 Jun 2020 |
| Utility: ULTRASONIC WELDING SYSTEMS AND METHODS OF USING THE SAME Filling date: 26 Sep 2025 Issue date: 28 May 2020 | 26 Nov 2019 | 28 May 2020 |
| Utility: On-bonder automatic overhang die optimization tool for wire bonding and related methods Filling date: 26 Sep 2025 Issue date: 26 May 2020 | 26 Sep 2018 | 26 May 2020 |
| Utility: SYSTEMS AND METHODS FOR PERFORATING FLEXIBLE FILMS, AND RELATED PUNCHING TOOLS Filling date: 26 Sep 2025 Issue date: 20 Feb 2020 | 15 Aug 2019 | 20 Feb 2020 |
| Utility: Ribbon bonding tools, and methods of designing ribbon bonding tools Filling date: 26 Sep 2025 Issue date: 18 Feb 2020 | 30 Apr 2018 | 18 Feb 2020 |
| Utility: Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines Filling date: 26 Sep 2025 Issue date: 21 Jan 2020 | 30 Apr 2018 | 21 Jan 2020 |
