Kulicke and Soffa Industries
Patents, Design & Utilities

Last updated:

List of all Kulicke and Soffa Industries patents 61 in total

Status Patent
Application
Utility: WIRE BONDING MACHINES INCLUDING LINEAR MOTOR SYSTEMS External link
Filling date: 6 Sep 2025 Issue date: 8 Sep 2022
Application
Utility: METHODS OF DETERMINING SHEAR STRENGTH OF BONDED FREE AIR BALLS ON WIRE BONDING MACHINES External link
Filling date: 6 Sep 2025 Issue date: 25 Aug 2022
Application
Utility: SYSTEMS AND METHODS FOR PERFORATING FLEXIBLE FILMS, AND RELATED PUNCHING TOOLS External link
Filling date: 6 Sep 2025 Issue date: 4 Aug 2022
Grant
Utility: Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine External link
Filling date: 6 Sep 2025 Issue date: 2 Aug 2022
Application
Utility: INTELLIGENT PATTERN RECOGNITION SYSTEMS FOR WIRE BONDING AND OTHER ELECTRONIC COMPONENT PACKAGING EQUIPMENT, AND RELATED METHODS External link
Filling date: 6 Sep 2025 Issue date: 21 Jul 2022
Grant
Utility: Linear motors and wire bonding machines including the same External link
Filling date: 6 Sep 2025 Issue date: 12 Jul 2022
Application
Utility: METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BONDING TOOLS External link
Filling date: 6 Sep 2025 Issue date: 23 Jun 2022
Application
Utility: METHODS OF DETECTING CONNECTION ISSUES BETWEEN A WIRE BONDING TOOL AND AN ULTRASONIC TRANSDUCER OF A WIRE BONDING MACHINE External link
Filling date: 6 Sep 2025 Issue date: 16 Jun 2022
Grant
Utility: Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods External link
Filling date: 6 Sep 2025 Issue date: 24 May 2022
Grant
Utility: Systems and methods for perforating flexible films, and related punching tools External link
Filling date: 6 Sep 2025 Issue date: 24 May 2022
Application
Utility: SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING TRAJECTORIES IN THE FORMATION OF WIRE LOOPS External link
Filling date: 6 Sep 2025 Issue date: 19 May 2022
Application
Utility: ULTRASONIC WELDING SYSTEMS AND METHODS OF USING THE SAME External link
Filling date: 6 Sep 2025 Issue date: 12 May 2022
Application
Utility: METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF MONITORING AN ACCURACY OF BOND FORCE ON A WIRE BONDING MACHINE, AND RELATED METHODS External link
Filling date: 6 Sep 2025 Issue date: 5 May 2022
Grant
Utility: Systems and methods for bonding semiconductor elements External link
Filling date: 6 Sep 2025 Issue date: 5 Apr 2022
Grant
Utility: Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops External link
Filling date: 6 Sep 2025 Issue date: 29 Mar 2022
Grant
Utility: Ultrasonic welding systems and methods of using the same External link
Filling date: 6 Sep 2025 Issue date: 29 Mar 2022
Grant
Utility: Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops External link
Filling date: 6 Sep 2025 Issue date: 15 Mar 2022
Application
Utility: OVENS FOR EQUIPMENT SUCH AS DIE ATTACH SYSTEMS, FLIP CHIP BONDING SYSTEMS, CLIP ATTACH SYSTEMS, AND RELATED METHODS External link
Filling date: 6 Sep 2025 Issue date: 23 Dec 2021
Grant
Utility: Methods of bonding of semiconductor elements to substrates, and related bonding systems External link
Filling date: 6 Sep 2025 Issue date: 21 Dec 2021
Application
Utility: METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS External link
Filling date: 6 Sep 2025 Issue date: 16 Dec 2021
Application
Utility: METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A SUPPORT STRUCTURE ON A WIRE BONDING MACHINE, AND RELATED METHODS External link
Filling date: 6 Sep 2025 Issue date: 30 Sep 2021
Application
Utility: BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND RELATED METHODS External link
Filling date: 6 Sep 2025 Issue date: 2 Sep 2021
Application
Utility: METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS External link
Filling date: 6 Sep 2025 Issue date: 26 Aug 2021
Application
Utility: ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAME External link
Filling date: 6 Sep 2025 Issue date: 19 Aug 2021
Application
Utility: SYSTEMS AND METHODS FOR PERFORATING FLEXIBLE FILMS, AND RELATED PUNCHING TOOLS External link
Filling date: 6 Sep 2025 Issue date: 22 Jul 2021
Grant
Utility: Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods External link
Filling date: 6 Sep 2025 Issue date: 29 Jun 2021
Grant
Utility: Bond head assemblies including reflective optical elements, related bonding machines, and related methods External link
Filling date: 6 Sep 2025 Issue date: 8 Jun 2021
Grant
Utility: Systems and methods for perforating flexible films, and related punching tools External link
Filling date: 6 Sep 2025 Issue date: 18 May 2021
Grant
Utility: Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same External link
Filling date: 6 Sep 2025 Issue date: 18 May 2021
Grant
Utility: Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods External link
Filling date: 6 Sep 2025 Issue date: 18 May 2021
Grant
Utility: Wedge bonding tools, wedge bonding systems, and related methods External link
Filling date: 6 Sep 2025 Issue date: 27 Apr 2021
Application
Utility: METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS External link
Filling date: 6 Sep 2025 Issue date: 1 Apr 2021
Application
Utility: METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO A SUBSTRATE, INCLUDING USE OF A REDUCING GAS, AND RELATED BONDING MACHINES External link
Filling date: 6 Sep 2025 Issue date: 25 Feb 2021
Application
Utility: METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING LOCATION ON A WIRE BONDING MACHINE External link
Filling date: 6 Sep 2025 Issue date: 10 Dec 2020
Grant
Utility: Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machines External link
Filling date: 6 Sep 2025 Issue date: 8 Dec 2020
Grant
Utility: Ribbon bonding tools and methods of using the same External link
Filling date: 6 Sep 2025 Issue date: 24 Nov 2020
Application
Utility: METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING LOCATION ON A WIRE BONDING MACHINE External link
Filling date: 6 Sep 2025 Issue date: 5 Nov 2020
Application
Utility: LINEAR MOTORS AND WIRE BONDING MACHINES INCLUDING THE SAME External link
Filling date: 6 Sep 2025 Issue date: 29 Oct 2020
Application
Utility: RIBBON BONDING TOOLS AND METHODS OF USING THE SAME External link
Filling date: 6 Sep 2025 Issue date: 29 Oct 2020
Grant
Utility: Systems and methods of operating wire bonding machines including clamping systems External link
Filling date: 6 Sep 2025 Issue date: 1 Sep 2020
Application
Utility: SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS External link
Filling date: 6 Sep 2025 Issue date: 27 Aug 2020
Grant
Utility: Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine External link
Filling date: 6 Sep 2025 Issue date: 25 Aug 2020
Application
Utility: METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHODS FOR CHECKING FOR ADEQUATE CLEARANCE BETWEEN ADJACENT WIRE LOOPS External link
Filling date: 6 Sep 2025 Issue date: 6 Aug 2020
Grant
Utility: Systems and methods for bonding semiconductor elements External link
Filling date: 6 Sep 2025 Issue date: 23 Jun 2020
Grant
Utility: Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops External link
Filling date: 6 Sep 2025 Issue date: 2 Jun 2020
Application
Utility: ULTRASONIC WELDING SYSTEMS AND METHODS OF USING THE SAME External link
Filling date: 6 Sep 2025 Issue date: 28 May 2020
Grant
Utility: On-bonder automatic overhang die optimization tool for wire bonding and related methods External link
Filling date: 6 Sep 2025 Issue date: 26 May 2020
Application
Utility: SYSTEMS AND METHODS FOR PERFORATING FLEXIBLE FILMS, AND RELATED PUNCHING TOOLS External link
Filling date: 6 Sep 2025 Issue date: 20 Feb 2020
Grant
Utility: Ribbon bonding tools, and methods of designing ribbon bonding tools External link
Filling date: 6 Sep 2025 Issue date: 18 Feb 2020
Grant
Utility: Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines External link
Filling date: 6 Sep 2025 Issue date: 21 Jan 2020

Showing 1 to 50 of 61 patents.