Kulicke and Soffa Industries, Inc.
Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
Last updated:
Abstract:
A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.
Status:
Grant
Type:
Utility
Filling date:
15 Jan 2019
Issue date:
29 Jun 2021