Kulicke and Soffa Industries, Inc.
Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
Last updated:
Abstract:
A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.
Status:
Grant
Type:
Utility
Filling date:
3 Oct 2018
Issue date:
18 May 2021