Kulicke and Soffa Industries, Inc.
Systems and methods of operating wire bonding machines including clamping systems
Last updated:
Abstract:
A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).
Status:
Grant
Type:
Utility
Filling date:
9 Jan 2019
Issue date:
1 Sep 2020