Kulicke and Soffa Industries, Inc.
Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
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Abstract:
A method of operating a wire bonding machine is provided. The method includes the steps of: (a) supporting a substrate on a material handling system of the wire bonding machine; (b) changing a bend profile of the substrate; and (c) securing, after step (b), the substrate against a support structure of the wire bonding machine using a clamping element of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, and the clamping element for securing the substrate to the support structure during the wire bonding operation.
Status:
Grant
Type:
Utility
Filling date:
30 Apr 2018
Issue date:
21 Jan 2020