Lam Research Corporation
DIRECTIONAL DEPOSITION IN ETCH CHAMBER

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Abstract:

Methods for forming a vertical growth mask for use in etching applications are described herein. Disclosed embodiments include introducing a tungsten-containing deposition precursor and one or more carrier gases while igniting a plasma to deposit tungsten selectively on field regions of positive features of a patterned etch mask without substantial deposition on sidewalls of the positive features or on an exposed surface of a target layer underlying the patterned etch mask.

Status:
Application
Type:

Utility

Filling date:

29 Oct 2019

Issue date:

27 Jan 2022