Lam Research Corporation
COOLING SYSTEM FOR PROCESSING CHAMBER

Abstract:

An apparatus is provided. The apparatus comprises a processing chamber. A substrate support is within the processing chamber, wherein the substrate support is in thermal contact with a substrate. A cooling system cools the substrate support. The cooling system comprises a first refrigeration system. The first refrigeration system comprises a first refrigerant inlet for receiving the first refrigerant from a first refrigerant source outside of the refrigeration system, wherein the first refrigerant is at a first pressure, a first throttle, wherein the first throttle allows a controlled expansion of the first refrigerant, wherein the expansion of the first refrigerant cools the first refrigerant, a first heat transfer system, for absorbing heat and transferring heat to the cooled first refrigerant, and a first refrigerant return for directing the first refrigerant from the first refrigeration system at a second pressure away from the first refrigeration system.