Lam Research Corporation
CHUCK FOR PLASMA PROCESSING CHAMBER
Last updated:
Abstract:
An electrostatic chuck system for a plasma processing chamber is provided. A base plate comprising Al--SiC is provided. A ceramic plate is disposed over the base plate. A bonding layer bonds the ceramic plate to the base plate.
Status:
Application
Type:
Utility
Filling date:
4 Mar 2020
Issue date:
5 May 2022