Lam Research Corporation
SPINDLE ASSEMBLY FOR WAFER TRANSFER IN A MULTI-STATION PROCESS MODULE

Abstract:

A spindle assembly for transferring wafers in a multi-station process module is provided, including: a hub body, the hub body configured to be rotated about a center axis; a plurality of end effectors, each end effector having a first end configured for connection to the hub body and a second end configured to support a wafer; a plurality of covers; a plurality of fastener assemblies; wherein the first end of each end effector is clamped between a respective cover and a respective outer portion of the hub body by a respective fastener assembly, the respective fastener assembly including a wave spring that provides a consistent clamping force.