Lam Research Corporation
DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS
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Abstract:
A method of electroplating a metal into features, having substantially different depths, of a partially fabricated electronic device on a substrate is provided. The method includes adsorbing accelerator into the bottom of recessed features; partially filling the features by a bottom up fill mechanism in an electroplating solution; diffusing leveler into shallow features to decrease the plating rate in shallow features as compared to deep features; and electroplating more metal into the features such that the height of metal in deep features is similar to the height of metal in shallow features.
Status:
Application
Type:
Utility
Filling date:
22 Jul 2020
Issue date:
1 Sep 2022