Lam Research Corporation
HIGH DENSITY, MODULUS, AND HARDNESS AMORPHOUS CARBON FILMS AT LOW PRESSURE

Abstract:

Provided herein are methods and related apparatus for depositing an ashable hard mask (AHM) on a substrate in a low pressure chamber using a dual frequency radio frequency component. Low pressure plasma enhanced chemical vapor deposition may be used to increase the etch selectivity of the AHM, permitting the use of a thinner AHM for semiconductor processing operations.