Microsoft Corporation
Ventilated shield can

Abstract:

A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.