Microsoft Corporation
Headphone earcup including seamless cover

Abstract:

A headphone device having an earcup that is configured to form a portion of an acoustic assembly of a headphone device. The earcup includes a seamless three-dimensional cover. The cover is formed from a continuous fabric of interlocking yarn. The cover can include portions having different performance characteristics, such as acoustic properties and/or comfort properties, that can be provided using different knit patterns and/or different fabric materials.