Microsoft Corporation
Integrated circuit chip device with thermal control
Last updated:
Abstract:
An integrated circuit chip device configured provide thermal control by directing heat transfer away from a heat sensitive component. The structure directs the heat transfer away from the heat sensitive component so that the heat sensitive component can be maintained at reduced operating temperatures for improved performance.
Status:
Grant
Type:
Utility
Filling date:
18 Oct 2019
Issue date:
29 Jun 2021