Microsoft Corporation
Integrated circuit chip device with thermal control

Last updated:

Abstract:

An integrated circuit chip device configured provide thermal control by directing heat transfer away from a heat sensitive component. The structure directs the heat transfer away from the heat sensitive component so that the heat sensitive component can be maintained at reduced operating temperatures for improved performance.

Status:
Grant
Type:

Utility

Filling date:

18 Oct 2019

Issue date:

29 Jun 2021