Microsoft Corporation
Method for bonding a semiconductor substrate to a carrier

Abstract:

A method for fabricating a semiconductor device includes providing a semiconductor substrate and bonding the semiconductor substrate to a carrier. The semiconductor substrate includes an inert material layer and a semiconductor layer on the inert material layer. The semiconductor substrate is bonded to the carrier such that the inert material layer is between the carrier and the semiconductor substrate. By including an inert material layer between the carrier and the semiconductor substrate, a barrier against diffusion for any bonding agents used to bond the semiconductor substrate to the carrier is formed, thereby preserving the integrity of the semiconductor layer and allowing for the easy removal of the semiconductor substrate from the carrier.