Microsoft Corporation
STACKED SUPERCONDUCTING INTEGRATED CIRCUITS WITH THREE DIMENSIONAL RESONANT CLOCK NETWORKS

Abstract:

Stacked superconducting integrated circuits with three dimensional resonant clock networks are described. An apparatus, including a first superconducting integrated circuit having a first clock distribution network for distributing a first clock signal in the first superconducting integrated circuit, is provided. The apparatus further includes a second superconducting integrated circuit, stacked on top of the first superconducting integrated circuit, having a second clock distribution network for distributing a second clock signal in the second superconducting integrated circuit, where each of the first clock distribution network and the second clock distribution network comprises a clock structure having a plurality of unit cells, where each of the plurality of unit cells includes at least one spine and at least one stub, the at least one stub inductively coupled to a first superconducting circuit, and where each of the first clock signal and the second clock signal has a same resonant frequency.